Dual in-line package
OverviewApplicationsConstructionOrientation and lead numberingDescendantsSee also
In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on cir
This reference is intended for preliminary fiber and communications infrastructure research. Optical interface, fiber type, port or core capacity, electrical input and output, enclosure protection, cooling, installation limits and applicable standards must be verified for the specific project.